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一种用于铜表面的Ag-C复合涂层的制备方法 【EN】A kind of preparation method of the Ag-C composite coating for copper surface

申请(专利)号:CN201811524733.X国省代码:陕西 61
申请(专利权)人:【中文】西安工程大学【EN】Xi'an Engineering Univ.
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摘要:
【中文】本发明公开了一种用于铜表面的Ag‑C复合涂层的制备方法,具体按照以下步骤实施:首先,将基体依次放入丙酮、无水乙醇和去离子水中进行超声清洗,真空烘干;之后将基体放入磁控溅射真空室内的样品台上,采用直流磁控溅射法沉积Ag‑C复合涂层。通过基地预处理、抽真空、升温、溅射,得到了具有良好导电性、导热性、减磨性及自润滑性的Ag‑C复合涂层;且通过磁控溅射法制备的Ag‑C复合涂层石墨分布均匀并且涂层与基体的结合力强,镀层致密。 【EN】Paragraph:The invention discloses a kind of preparation methods of Ag-C composite coating for copper surface, are specifically implemented according to the following steps: being cleaned by ultrasonic firstly, matrix is sequentially placed into acetone, dehydrated alcohol and deionized water, vacuum drying;Matrix is put on the sample stage in magnetron sputtering vacuum chamber later, Ag-C composite coating is deposited using direct current magnetron sputtering process.It is pre-processed, vacuumized, heated up, sputtered by base, obtained the Ag-C composite coating with satisfactory electrical conductivity, thermal conductivity, anti-attrition and self-lubrication;And by magnetron sputtering method prepare Ag-C composite coating Graphite Distribution uniformly and the binding force of coating and matrix it is strong, plated layer compact.Image:

主权项:
【中文】1.一种用于铜表面的Ag-C复合涂层的制备方法,其特征在于,具体按照以下步骤实施: 步骤1,将基体依次放入丙酮、无水乙醇和去离子水中进行超声清洗,清洗时间均为8~10min,之后真空烘干; 步骤2,将经步骤1处理的基体放入磁控溅射真空室内的样品台上,采用直流磁控溅射法沉积Ag-C复合涂层。 【EN】1. a kind of preparation method of the Ag-C composite coating for copper surface, which is characterized in that be specifically implemented according to the following steps: Step 1, matrix being sequentially placed into acetone, dehydrated alcohol and deionized water and is cleaned by ultrasonic, scavenging period is 8~ 10min, later vacuum drying; Step 2, the matrix handled through step 1 is put on the sample stage in magnetron sputtering vacuum chamber, using magnetically controlled DC sputtering Method deposits Ag-C composite coating.


说明书

【中文】

一种用于铜表面的Ag-C复合涂层的制备方法

技术领域

本发明属于涂层制备技术领域,涉及一种用于铜表面的Ag-C复合涂层的制备方法。

背景技术

银石墨复合电接触材料的制备方法有粉末冶金法、烧结挤压法。作为传统工艺,粉末冶金法制备得到的银石墨,由于石墨较轻,作为增强相粉体与银粉混合难以做到均匀分散,从而降低电接触材料的电导率和延伸率,而烧结挤压法对设备的要求很高,成品需切割,材料回收率低,成本昂贵。银具有良好的导电、导热性能,石墨具有良好的减磨、自润滑性能。银含量增加可以改善导电、导热性,但会导致耐磨性下降和成本的大幅度提升,石墨含量增加可以改善润滑、耐磨性,但同时也会降低材料的强度和导热性。如何实现银和石墨两者间的性能优势互补就变成了一个急需解决的问题。因此,寻找一种能够同时提高Ag-C复合涂层导电、导热性和减磨、自润滑性,并且生产工艺简单、成本低的制备方法是非常有必要的。

发明内容

本发明的目的是提供一种用于铜表面的Ag-C复合涂层的制备方法,提高了Ag-C复合涂层的导电及导热性能。

本发明所采用的技术方案是,一种用于铜表面的Ag-C复合涂层的制备方法,具体按照以下步骤实施:

步骤1,将基体依次放入丙酮、无水乙醇和去离子水中进行超声清洗,清洗时间均为8~10min,之后真空烘干;

步骤2,将经步骤1处理的基体放入磁控溅射真空室内的样品台上,采用直流磁控溅射法沉积Ag-C复合涂层。

本发明的特点还在于,

步骤1中,基体为铜基体或者铜合金基体。

步骤1中,烘干温度为50~80℃,烘干时间为10~30min。

步骤2中,采用直流磁控溅射法沉积Ag-C复合涂层,具体为:

选用纯度均为99.999%的Ag靶和石墨靶作为靶材,以纯度为99.99%氩气作为起辉气体,本地真空度为4.0×10-4~9.9×10-4Pa,先通入氩气进行预溅射,石墨靶材预溅射功率为40~100W,Ag靶预溅射功率为100~250W,预溅射时间为10~30min,以除去靶材表面的氧化物,之后将石墨靶材溅射功率调至40~120W,Ag靶溅射功率调至100~300W,进行共溅射,溅射时间为5~30min,即可得到Ag-C复合涂层。

预溅射和溅射时,溅射气压为2~7Pa,氩气流量为30~50ml/s,基体温度为25~300℃,靶材与基体之间的距离为2~8cm,沉积厚度为1~5μm。

本发明的有益效果是,

该方法通过基地预处理、抽真空、升温、溅射的步骤,得到了具有良好导电性、导热性、减磨性及自润滑性的Ag-C复合涂层;通过磁控溅射法制备的Ag-C复合涂层石墨分布均匀并且涂层与基体的结合力强,镀层致密。

具体实施方式

下面结合具体实施方式对本发明进行详细说明。

本发明一种用于铜表面的Ag-C复合涂层的制备方法,具体按照以下步骤实施:

步骤1,将基体依次放入丙酮、无水乙醇和去离子水中进行超声清洗,清洗时间均为8~10min,清除基体表面的油污、灰尘等杂质,之后真空烘干,烘干温度为50~80℃,烘干时间为10~30min;

基体为铜基体或者铜合金基体;

步骤2,将经步骤1处理的基体放入磁控溅射真空室内的样品台上,采用直流磁控溅射法沉积Ag-C复合涂层;

具体为:选用纯度均为99.999%的Ag靶和石墨靶作为靶材,以纯度为99.99%氩气作为起辉气体,本地真空度为4.0×10-4~9.9×10-4Pa,先通入氩气进行预溅射,石墨靶材预溅射功率为40~100W,Ag靶预溅射功率为100~250W,预溅射时间为10~30min,以除去靶材表面的氧化物,之后将石墨靶材溅射功率调至40~120W,Ag靶溅射功率调至100~300W,进行共溅射,溅射时间为5~30min,即可得到Ag-C复合涂层;

其中,预溅射和溅射时,溅射气压为2~7Pa,氩气流量为30~50ml/s,基体温度为25~300℃,靶材与基体之间的距离为2~8cm,沉积厚度为1~5μm。

实施例1

本发明一种用于铜表面的Ag-C复合涂层的制备方法,具体按照以下步骤实施:

步骤1,将铜基体依次放入丙酮、无水乙醇和去离子水中进行超声清洗,清洗时间均为8min,清除基体表面的油污、灰尘等杂质,之后真空烘干,烘干温度为50℃,烘干时间为10min;

步骤2,将经步骤1处理的基体放入磁控溅射真空室内的样品台上,采用直流磁控溅射法沉积Ag-C复合涂层;

具体为:选用纯度均为99.999%的Ag靶和石墨靶作为靶材,以纯度为99.99%氩气作为起辉气体,本地真空度为4.0×10-4Pa,先通入氩气进行预溅射,石墨靶材预溅射功率为40W,Ag靶预溅射功率为100W,预溅射时间为10min,以除去靶材表面的氧化物,之后将石墨靶材溅射功率调至40W,Ag靶溅射功率调至100W,进行溅射,溅射时间为5min,即可得到Ag-C复合涂层;

其中,预溅射和溅射时,溅射气压为2Pa,氩气流量为30ml/s,基体温度为25℃;靶材与基体之间的距离为2cm,沉积厚度为1μm。

实施例2

本发明一种用于铜表面的Ag-C复合涂层的制备方法,具体按照以下步骤实施:

步骤1,将铜合金基体依次放入丙酮、无水乙醇和去离子水中进行超声清洗,清洗时间均为9min,清除基体表面的油污、灰尘等杂质,之后真空烘干,烘干温度为60℃,烘干时间为15min;

步骤2,将经步骤1处理的基体放入磁控溅射真空室内的样品台上,采用直流磁控溅射法沉积Ag-C复合涂层;

具体为:选用纯度均为99.999%的Ag靶和石墨靶作为靶材,以纯度为99.99%氩气作为起辉气体,本地真空度为4.0×10-4~9.9×10-4Pa,先通入氩气进行预溅射,石墨靶材预溅射功率为60W,Ag靶预溅射功率为130W,预溅射时间为15min,以除去靶材表面的氧化物,之后将石墨靶材溅射功率调至60W,Ag靶溅射功率调至1500W,进行溅射,溅射时间为10min,即可得到Ag-C复合涂层;

其中,溅射气压为4Pa,氩气流量为35ml/s,基体温度为50℃;

靶材与基体之间的距离为4cm,沉积厚度为2μm。

实施例3

本发明用于一种铜表面的Ag-C复合涂层的制备方法,具体按照以下步骤实施:

步骤1,将基体依次放入丙酮、无水乙醇和去离子水中进行超声清洗,清洗时间均为10min,清除基体表面的油污、灰尘等杂质,之后真空烘干,烘干温度为70℃,烘干时间为20min;

基体为铜基体或者铜合金基体;

步骤2,将经步骤1处理的基体放入磁控溅射真空室内的样品台上,采用直流磁控溅射法沉积Ag-C复合涂层;

具体为:选用纯度均为99.999%的Ag靶和石墨靶作为靶材,以纯度为99.99%氩气作为起辉气体,本地真空度为7.5×10-4,先通入氩气进行预溅射,石墨靶材预溅射功率为80W,Ag靶预溅射功率为150W,预溅射时间为20min,以除去靶材表面的氧化物,之后将石墨靶材溅射功率调至80W,Ag靶溅射功率调至200W,进行溅射,溅射时间为20min,即可得到Ag-C复合涂层;

其中,溅射气压为5Pa,氩气流量为40ml/s,基体温度为100℃;

靶材与基体之间的距离为6cm,沉积厚度为3μm。

实施例4

本发明用于一种铜表面的Ag-C复合涂层的制备方法,具体按照以下步骤实施:

步骤1,将铜基体依次放入丙酮、无水乙醇和去离子水中进行超声清洗,清洗时间均为10min,清除基体表面的油污、灰尘等杂质,之后真空烘干,烘干温度为75℃,烘干时间为25min;

步骤2,将经步骤1处理的基体放入磁控溅射真空室内的样品台上,采用直流磁控溅射法沉积Ag-C复合涂层;

具体为:选用纯度均为99.999%的Ag靶和石墨靶作为靶材,以纯度为99.99%氩气作为起辉气体,本地真空度为8.5×10-4Pa,先通入氩气进行预溅射,石墨靶材预溅射功率为90W,Ag靶预溅射功率为200W,预溅射时间为25min,以除去靶材表面的氧化物,之后将石墨靶材溅射功率调至100W,Ag靶溅射功率调至230W,进行溅射,溅射时间为25min,即可得到Ag-C复合涂层;

其中,溅射气压为6Pa,氩气流量为45ml/s,基体温度为200℃,

靶材与基体之间的距离为7cm,沉积厚度为4μm。

实施例5

本发明用于一种铜表面的Ag-C复合涂层的制备方法,具体按照以下步骤实施:

步骤1,将基体依次放入丙酮、无水乙醇和去离子水中进行超声清洗,清洗时间均为9min,清除基体表面的油污、灰尘等杂质,之后真空烘干,烘干温度为80℃,烘干时间为30min;

基体为铜基体或者铜合金基体;

步骤2,将经步骤1处理的基体放入磁控溅射真空室内的样品台上,采用直流磁控溅射法沉积Ag-C复合涂层;

具体为:选用纯度均为99.999%的Ag靶和石墨靶作为靶材,以纯度为99.99%氩气作为起辉气体,本地真空度为9.9×10-4Pa,先通入氩气进行预溅射,石墨靶材预溅射功率为100W,Ag靶预溅射功率为250W,预溅射时间为30min,以除去靶材表面的氧化物,之后将石墨靶材溅射功率调至120W,Ag靶溅射功率调至300W,进行溅射,溅射时间为30min,即可得到Ag-C复合涂层;

其中,溅射气压为7Pa,氩气流量为50ml/s,基体温度为300℃;

靶材与基体之间的距离为8cm,沉积厚度为5μm。

本发明一种用于铜表面的Ag-C复合涂层的制备方法,解决了粉末冶金法制备银石墨所产生的问题,即由于石墨较轻,作为增强相粉体与银粉混合难以做到均匀分散,从而降低电接触材料的电导率和延伸率,而磁控溅射法制备Ag-C复合涂层石墨分布均匀并且涂层与基体的结合力强,镀层致密。

本发明一种用于铜表面的Ag-C复合涂层的制备方法,与传统工艺方法,如粉末冶金法,烧结挤压法相比,磁控溅射法制备Ag-C复合涂层的方法效率高,工艺简单,降低了成本。

【EN】

A kind of preparation method of the Ag-C composite coating for copper surface

Technical field

The invention belongs to coat preparing technology fields, are related to a kind of preparation side of Ag-C composite coating for copper surface

Method.

Background technique

The preparation method of silver-colored graphite composited contact material has powder metallurgic method, sintering extrusion.As traditional handicraft, powder

The silver-colored graphite that last metallurgy method is prepared mixes to be difficult to and uniformly divide as reinforced phase powder since graphite is lighter with silver powder

It dissipates, to reduce the conductivity and elongation percentage of contact material, and is sintered that requirement of the extrusion to equipment is very high, and finished product need to be cut

It cuts, material yield rate is low, expensive.Silver has good conductive, heating conduction, and graphite has good anti-attrition, self-lubricating

Performance.Silver content increase can improve conductive, thermal conductivity, but will lead to the significantly promotion of wearability decline and cost, graphite

Content increase can improve lubrication, wearability, but can also reduce the intensity and thermal conductivity of material simultaneously.How silver and graphite are realized

Performance advantage complementation between the two has reformed into a urgent problem.Therefore, Ag-C can be improved simultaneously by finding one kind

Composite coating conduction, thermal conductivity and anti-attrition, self-lubrication, and simple production process, preparation method at low cost are that have very much

It is necessary.

Summary of the invention

The object of the present invention is to provide a kind of preparation methods of Ag-C composite coating for copper surface, and it is multiple to improve Ag-C

Close the conduction and heating conduction of coating.

The technical scheme adopted by the invention is that a kind of preparation method of the Ag-C composite coating for copper surface, specifically

It follows the steps below to implement:

Step 1, matrix is sequentially placed into acetone, dehydrated alcohol and deionized water and is cleaned by ultrasonic, scavenging period is equal

For 8~10min, vacuum drying later;

Step 2, the matrix handled through step 1 is put on the sample stage in magnetron sputtering vacuum chamber, using direct magnetic control

Sputtering method deposits Ag-C composite coating.

The features of the present invention also characterized in that

In step 1, matrix is Copper substrate or copper alloy matrix.

In step 1, drying temperature is 50~80 DEG C, and drying time is 10~30min.

In step 2, Ag-C composite coating is deposited using direct current magnetron sputtering process, specifically:

The Ag target and graphite target for selecting purity to be 99.999% as target, using purity be 99.99% argon gas as

Brightness gas, local vacuum degree are 4.0 × 10-4~9.9 × 10-4Pa is first passed through argon gas and carries out pre-sputtering, graphite target pre-sputtering

Power is 40~100W, and Ag target pre-sputtering power is 100~250W, and the pre-sputtering time is 10~30min, to remove target material surface

Oxide, graphite target sputtering power is adjusted to 40~120W later, Ag target sputtering power is adjusted to 100~300W, is total to

Sputtering, sputtering time are 5~30min, and Ag-C composite coating can be obtained.

Pre-sputtering and sputtering when, sputtering pressure be 2~7Pa, argon flow be 30~50ml/s, substrate temperature be 25~

300 DEG C, the distance between target and matrix are 2~8cm, and deposition thickness is 1~5 μm.

The invention has the advantages that

The step of this method is pre-processed by base, vacuumized, heated up, sputtered has obtained having satisfactory electrical conductivity, thermally conductive

The Ag-C composite coating of property, anti-attrition and self-lubrication;The Ag-C composite coating Graphite Distribution prepared by magnetron sputtering method is equal

The binding force of even and coating and matrix is strong, plated layer compact.

Specific embodiment

The present invention is described in detail With reference to embodiment.

A kind of preparation method of the Ag-C composite coating for copper surface of the present invention, is specifically implemented according to the following steps:

Step 1, matrix is sequentially placed into acetone, dehydrated alcohol and deionized water and is cleaned by ultrasonic, scavenging period is equal

For 8~10min, the impurity such as greasy dirt, the dust of matrix surface are removed, later vacuum drying, drying temperature is 50~80 DEG C, drying

Time is 10~30min;

Matrix is Copper substrate or copper alloy matrix;

Step 2, the matrix handled through step 1 is put on the sample stage in magnetron sputtering vacuum chamber, using direct magnetic control

Sputtering method deposits Ag-C composite coating;

Specifically: the Ag target and graphite target for selecting purity to be 99.999% are as target, with purity for 99.99% argon gas

As build-up of luminance gas, local vacuum degree is 4.0 × 10-4~9.9 × 10-4Pa is first passed through argon gas and carries out pre-sputtering, graphite target

Pre-sputtering power is 40~100W, and Ag target pre-sputtering power is 100~250W, and the pre-sputtering time is 10~30min, to remove target

Graphite target sputtering power is adjusted to 40~120W later by the oxide on material surface, and Ag target sputtering power is adjusted to 100~300W,

Cosputtering is carried out, sputtering time is 5~30min, and Ag-C composite coating can be obtained;

Wherein, when pre-sputtering and sputtering, sputtering pressure is 2~7Pa, and argon flow is 30~50ml/s, and substrate temperature is

25~300 DEG C, the distance between target and matrix are 2~8cm, and deposition thickness is 1~5 μm.

Embodiment 1

A kind of preparation method of the Ag-C composite coating for copper surface of the present invention, is specifically implemented according to the following steps:

Step 1, Copper substrate is sequentially placed into acetone, dehydrated alcohol and deionized water and is cleaned by ultrasonic, scavenging period

It is 8min, removes the impurity such as greasy dirt, the dust of matrix surface, later vacuum drying, drying temperature is 50 DEG C, and drying time is

10min;

Step 2, the matrix handled through step 1 is put on the sample stage in magnetron sputtering vacuum chamber, using direct magnetic control

Sputtering method deposits Ag-C composite coating;

Specifically: the Ag target and graphite target for selecting purity to be 99.999% are as target, with purity for 99.99% argon gas

As build-up of luminance gas, local vacuum degree is 4.0 × 10-4Pa is first passed through argon gas and carries out pre-sputtering, and graphite target pre-sputtering power is

40W, Ag target pre-sputtering power are 100W, and the pre-sputtering time is 10min, to remove the oxide of target material surface, later by graphite

Target as sputter power is adjusted to 40W, and Ag target sputtering power is adjusted to 100W, is sputtered, and Ag-C can be obtained in sputtering time 5min

Composite coating;

Wherein, when pre-sputtering and sputtering, sputtering pressure 2Pa, argon flow 30ml/s, substrate temperature are 25 DEG C;Target

The distance between material and matrix are 2cm, and deposition thickness is 1 μm.

Embodiment 2

A kind of preparation method of the Ag-C composite coating for copper surface of the present invention, is specifically implemented according to the following steps:

Step 1, copper alloy matrix is sequentially placed into acetone, dehydrated alcohol and deionized water and is cleaned by ultrasonic, cleaned

Time is 9min, removes the impurity such as greasy dirt, the dust of matrix surface, later vacuum drying, and drying temperature is 60 DEG C, when drying

Between be 15min;

Step 2, the matrix handled through step 1 is put on the sample stage in magnetron sputtering vacuum chamber, using direct magnetic control

Sputtering method deposits Ag-C composite coating;

Specifically: the Ag target and graphite target for selecting purity to be 99.999% are as target, with purity for 99.99% argon gas

As build-up of luminance gas, local vacuum degree is 4.0 × 10-4~9.9 × 10-4Pa is first passed through argon gas and carries out pre-sputtering, graphite target

Pre-sputtering power is 60W, and Ag target pre-sputtering power is 130W, and the pre-sputtering time is 15min, to remove the oxidation of target material surface

Graphite target sputtering power is adjusted to 60W later by object, and Ag target sputtering power is adjusted to 1500W, is sputtered, and sputtering time is

Ag-C composite coating can be obtained in 10min;

Wherein, sputtering pressure 4Pa, argon flow 35ml/s, substrate temperature are 50 DEG C;

The distance between target and matrix are 4cm, and deposition thickness is 2 μm.

Embodiment 3

Preparation method of the present invention for a kind of Ag-C composite coating on copper surface, is specifically implemented according to the following steps:

Step 1, matrix is sequentially placed into acetone, dehydrated alcohol and deionized water and is cleaned by ultrasonic, scavenging period is equal

For 10min, the impurity such as greasy dirt, the dust of matrix surface are removed, later vacuum drying, drying temperature is 70 DEG C, and drying time is

20min;

Matrix is Copper substrate or copper alloy matrix;

Step 2, the matrix handled through step 1 is put on the sample stage in magnetron sputtering vacuum chamber, using direct magnetic control

Sputtering method deposits Ag-C composite coating;

Specifically: the Ag target and graphite target for selecting purity to be 99.999% are as target, with purity for 99.99% argon gas

As build-up of luminance gas, local vacuum degree is 7.5 × 10-4, first it is passed through argon gas and carries out pre-sputtering, graphite target pre-sputtering power is

80W, Ag target pre-sputtering power are 150W, and the pre-sputtering time is 20min, to remove the oxide of target material surface, later by graphite

Target as sputter power is adjusted to 80W, and Ag target sputtering power is adjusted to 200W, is sputtered, and Ag- can be obtained in sputtering time 20min

C composite coating;

Wherein, sputtering pressure 5Pa, argon flow 40ml/s, substrate temperature are 100 DEG C;

The distance between target and matrix are 6cm, and deposition thickness is 3 μm.

Embodiment 4

Preparation method of the present invention for a kind of Ag-C composite coating on copper surface, is specifically implemented according to the following steps:

Step 1, Copper substrate is sequentially placed into acetone, dehydrated alcohol and deionized water and is cleaned by ultrasonic, scavenging period

It is 10min, removes the impurity such as greasy dirt, the dust of matrix surface, later vacuum drying, drying temperature is 75 DEG C, drying time

For 25min;

Step 2, the matrix handled through step 1 is put on the sample stage in magnetron sputtering vacuum chamber, using direct magnetic control

Sputtering method deposits Ag-C composite coating;

Specifically: the Ag target and graphite target for selecting purity to be 99.999% are as target, with purity for 99.99% argon gas

As build-up of luminance gas, local vacuum degree is 8.5 × 10-4Pa is first passed through argon gas and carries out pre-sputtering, and graphite target pre-sputtering power is

90W, Ag target pre-sputtering power are 200W, and the pre-sputtering time is 25min, to remove the oxide of target material surface, later by graphite

Target as sputter power is adjusted to 100W, and Ag target sputtering power is adjusted to 230W, is sputtered, and sputtering time 25min can be obtained

Ag-C composite coating;

Wherein, sputtering pressure 6Pa, argon flow 45ml/s, substrate temperature are 200 DEG C,

The distance between target and matrix are 7cm, and deposition thickness is 4 μm.

Embodiment 5

Preparation method of the present invention for a kind of Ag-C composite coating on copper surface, is specifically implemented according to the following steps:

Step 1, matrix is sequentially placed into acetone, dehydrated alcohol and deionized water and is cleaned by ultrasonic, scavenging period is equal

For 9min, the impurity such as greasy dirt, the dust of matrix surface are removed, later vacuum drying, drying temperature is 80 DEG C, and drying time is

30min;

Matrix is Copper substrate or copper alloy matrix;

Step 2, the matrix handled through step 1 is put on the sample stage in magnetron sputtering vacuum chamber, using direct magnetic control

Sputtering method deposits Ag-C composite coating;

Specifically: the Ag target and graphite target for selecting purity to be 99.999% are as target, with purity for 99.99% argon gas

As build-up of luminance gas, local vacuum degree is 9.9 × 10-4Pa is first passed through argon gas and carries out pre-sputtering, and graphite target pre-sputtering power is

100W, Ag target pre-sputtering power are 250W, and the pre-sputtering time is 30min, to remove the oxide of target material surface, later by graphite

Target as sputter power is adjusted to 120W, and Ag target sputtering power is adjusted to 300W, is sputtered, and sputtering time 30min can be obtained

Ag-C composite coating;

Wherein, sputtering pressure 7Pa, argon flow 50ml/s, substrate temperature are 300 DEG C;

The distance between target and matrix are 8cm, and deposition thickness is 5 μm.

A kind of preparation method of the Ag-C composite coating for copper surface of the present invention solves powder metallurgic method and prepares silver-colored stone

The problem that black, i.e., since graphite is lighter, mix as reinforced phase powder with silver powder be difficult to it is evenly dispersed, to drop

The conductivity and elongation percentage of low contact material, and magnetron sputtering method prepares Ag-C composite coating Graphite Distribution uniformly and coating

Strong, the plated layer compact with the binding force of matrix.

A kind of preparation method of the Ag-C composite coating for copper surface of the present invention, and Conventional processing methods, such as powder smelting

Jin Fa, sintering extrusion are compared, and the method that magnetron sputtering method prepares Ag-C composite coating is high-efficient, and simple process is reduced into

This.

图1
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